DuPont Advanced Packaging Lithography has more than 30 years of experience with dry film photoresists. APL manufactures microlithographic polymer films for advanced semiconductor packaging applications, including:
- Wafer bumping
- UBM formation
- Copper pillars
- Lift off
- TSV
- Permanent and temporary bonding
- Backside wafer coating
- MEMS applications
DuPont offers the most advanced negative photoresist formulations for excellent productivity, environmental responsibility, simple processing and high yields. Our dry film photoresist solutions allow solvent free, aqueous-based developer and remover processing , without jeopardizing cleanliness and resolution.
![Global [change]](/globalassets/v3/images/en_US/topNav_Mn_count.gif)
